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 FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
October 2006
FOD050L, FOD250L: Single Channel FOD053L: Dual Channel LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Features
Low power consumption High speed Available in single channel 8-pin DIP (FOD250L),
Description
The FOD250L, FOD050L and FOD053L optocouplers consist of an AlGaAs LED optically coupled to a high speed photodetector transistor. These devices are specified for operation at a 3.3V supply voltage. A separate connection for the bias of the photodiode improves the speed by several orders of magnitude over conventional phototransistor optocouplers by reducing the base-collector capacitance of the input transistor. An internal noise shield provides superior common mode rejection of CMH = 50kV/ms (typical) and CML = 35kV/ms (typical).

8-pin SOIC (FOD050L) or dual channel 8-pin SOIC (FOD053L) Superior CMR - CMH = 50kV/s (typical) and CML = 35kV/s (typical) Guaranteed performance over temperature: 0C to 70C U.L. recognized (File # E90700) VDE pending
Applications
Line receivers Pulse transformer replacement High speed logic ground isolation: LVTTL/LVCMOS Wide bandwidth analog coupling
Schematic
N/C 1
8 VCC
+1 V
F1
8 VCC
8 1
+2 VF _ 3
7 VB
_
2
7 V01
8 8 1 1
6 VO
_ V
3
6 V02
F2
N/C 4
5 GND
+4
5 GND
FOD050L, FOD250L
FOD053L
Truth Table
LED On Off VO LOW HIGH
(c)2002 Fairchild Semiconductor Corporation
1
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FOD050L, FOD250L, FOD053L Rev. 1.0.0
FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Absolute Maximum Ratings
Symbol
TSTG TOPR TSOL EMITTER IF (avg) IF (pk) IF (trans) VR PD DETECTOR IO (avg) IO (pk) VEBR VCC VO IB PD Average Output Current Peak Output Current Storage Temperature Operating Temperature
(TA = 25C Unless otherwise specified.)
Parameter
Value
-40 to +125 -40 to +85 260 for 10 sec Each Channel Each Channel Each Channel Each Channel Each Channel 25 50 1.0 5 45
Units
C C C mA mA A V mW
Lead Solder Temperature (Wave solder only) DC/Average Forward Input Current Peak Forward Input Current (50% duty cycle, 1ms P.W.) Peak Transient Input Current (1 s P.W., 300pps) Reverse Input Voltage Input Power Dissipation (No derating required up to 85C)
Each Channel Each Channel FOD050L, FOD250L only
8 16 5 -0.5 to 7 -0.5 to 7
mA mA V V V mA mW
Emitter-Base Reverse Voltage Supply Voltage Output Voltage Base Current Output Power Dissipation (No derating required up to 85C)
FOD050L, FOD250L only Each Channel
5 100
2 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Electrical Characteristics
(TA = 0 to 70C Unless otherwise specified.)
Individual Component Characteristics
Symbol
EMITTER VF BVR Input Forward Voltage Input Reverse Breakdown Voltage Logic High Output Current Logic Low Supply Current IF = 16mA, TA =25C IF = 16mA IR = 10A All 5.0 All 1.45 1.7 1.8 V V
Parameter
Test Conditions
Device
Min.
Typ.**
Max.
Unit
DETECTOR IOH ICCL IF = 0mA, VO = VCC = 3.3V, TA = 25C IF = 16mA, VO = Open, VCC = 3.3V IF1 = IF2 = 16mA, VO = Open, VCC = 3.3V ICCH Logic High Supply Current IF = 0mA, VO = Open, VCC = 3.3V, TA = 25C IF = 0mA, VO = Open, VCC = 3.3V **All Typicals at TA = 25C All FOD050L FOD250L FOD053L FOD050L FOD250L FOD053L 0.001 1 200 400 0.3 10 A A A
Transfer Characteristics
Symbol
COUPLED CTR VOL Current Transfer Ratio(1) Logic Low Output Voltage Output Voltage IF = 16mA, VO = 0.4 V, VCC = 3.3V, TA = 25C IF = 16mA, IO = 3mA, VCC = 3.3V, TA = 25C All All 15 50 0.3 % V
Parameter
Test Conditions
Device
Min.
Typ.** Max.
Unit
**All Typicals at TA = 25C Note: 1. Current Transfer Ratio is defined as a ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
3 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Switching Characteristics (TA = 0 to 70C Unless otherwise specified, VCC = 3.3V.)
Symbol
TPHL TPLH |CMH|
Parameter
Propagation Delay Time to Logic Low Propagation Delay Time to Logic High Common Mode Transient Immunity at Logic High
Test Conditions
RL = 1.9k, IF = (Fig. 10) 16mA(2) 25C 25C
Device
All All All
Min.
Typ.**
Max. Unit
1.0 2.0 1.0 2.0 s V/s V/s s
RL = 1.9k, IF = 16mA(2) (Fig. 10)
IF = 0mA, VCM = 1,000VP-P, RL = 4.1k, TA = 25C(3,4) (Fig. 11) IF = 0mA, VCM = 1,000VP-P, TA = 25C, RL = 1.9k(2,4) (Fig. 11) IF = 16mA, VCM = 1,000VP-P, RL = 4.1k. TA = 25C(3,4) (Fig. 11) IF = 16mA, VCM = 1,000 VP-P, RL = 1.9k(2,4) (Fig. 11)
5,000 5,000
50,000 50,000
|CML|
Common Mode Transient Immunity at Logic Low
All
5,000
35,000
V/s
5,000
35,000
V/s
** All Typicals at TA = 25C
Isolation Characteristics (TA = 0 to 70C Unless otherwise specified.)
Symbol
II-O
Characteristics
Input-Output Insulation Leakage Current Withstand Insulation Test Voltage Resistance (input to output) Capacitance (input to output)
Test Conditions
Relative humidity = 45%, TA = 25C, t = 5s, VI-O = 3000VDC(5) f = 60Hz, TA = 25C, t = 1 min.(5) VI-O = 500VDC(5)
Device
All
Min.
Typ.**
Max.
1.0
Unit
A
VISO
FOD050L FOD053L FOD250L All All
2500 5000 1011 1012 0.2
VRMS
RI-O CI-O
pF
f = 1MHz(5)
Notes: 2. The 1.9k load represents 1 TTL unit load of 1.6mA and 5.6k pull-up resistor. 3. The 4.1k load represents 1 LSTTL unit load of 0.36mA and 6.1k pull-up resistor. 4. Common mode transient immunity in logic high level is the maximum tolerable (positive) dVcm/dt on the leading edge of the common mode pulse signal VCM, to assure that the output will remain in a logic high state (i.e., VO > 2.0V). Common mode transient immunity in logic low level is the maximum tolerable (negative) dVcm/dt on the trailing edge of the common mode pulse signal, VCM, to assure that the output will remain in a logic low state (i.e., VO < 0.8V). 5. Device is considered a two terminal device: Pins 1, 2, 3 and 4 are shorted together and Pins 5, 6, 7 and 8 are shorted together.
4 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Typical Performance Curves
Fig. 1 LED Forward Current vs. Forward Voltage
100 1.3 V O = 0.4V V CC = 3.3V Normalized to IF = 16mA, TA = 25C
Fig. 2 Current Transfer Ratio vs. Forward Current (FOD050L, FOD053L)
1.2
Current Transfer Ratio (Normalized)
10
IF - Forward Current (mA)
T A = 85C 1 T A = 70C T A = 25C T A = 0C T A = -40C
1.1
T A = 70C T A = 85C
1.0
T A = 25C
0.1
0.9
T A = 0CC
0.8
0.01
0.7
T A = -40C
0.001 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7
0.6 0 5 10 15 20 25
V F - Forward Voltage (V)
IF - Forward Current (mA)
Fig. 3 Current Transfer Ratio vs. Input Forward Current (FOD250L)
1.4 1.3
Fig. 4 Current Transfer Ratio vs. Ambient Temperature
1.6 1.6
VO = 0.4V VCC = 3.3V TA = 85C TA = 70C
Normalized to IF = 16mA, TA = 25C
1.4
Current Transfer Ratio (Normalized)
1.2 1.1 1.0 0.9 0.8 0.7
Current Transfer Ratio (Normalized)
IF = 16mA VO = 0.4V VCC = 3.3V
Normalized to TA = 25C
1.4
TA = 25C
1.0
1.0
0.8
0.8
TA = 0C
0.6
0.6
0.4
0.4
TA = -40C
0.6 0.5 0 5 10 15 20 25
0.2
0.2
0.0 -40 -20 0 20 40 60 80 100
0.0
IF - Forward Current (mA)
T A - Ambient Temperature (C)
Fig. 5 Output Current vs. Output Voltage
12
Fig 6. Logic High Output Current vs. Ambient Temperature
10
TA = 25C VCC = 3.3V
VO = VCC = 3.3V IF = 0
IO - Output Current (mA)
IF = 25mA
8
I OH - Logic High Output Current (nA)
10
1
20mA
6
15mA
4
0.1
10mA
2
5mA
0 0 2 4 6 8 10 12 14 16
0.01 -40 -20 0 20 40 60 80 100
VO - Output Voltage (V)
TA - Ambient Temperature ( C)
5 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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IC - Collector Current (mA) I LED = 1mA
1.2
1.2
FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Fig. 7 Supply Current vs. Input Forward Current
120 3.5
Fig. 8 Propagation Delay vs. Ambient Temperature
V
3.0
TA = 25C VCC = 3.3V
CC
= 3.3V
IF = 16mA
I CC (Per Channel) - Supply Current (A)
100
tP - Propagation Delay (s)
2.5
80
tPLH, RL = 4.1k
2.0
60
1.5
40
tPLH, RL = 1.9k
1.0
20
0.5
tPHL, RL = 1.9k & 4.1k
0 0 2 4 6 8 10 12 14 16
0.0 -40 -20 0 20 40 60 80 100
IF - Input Forward Current (mA)
TA - Ambient Temperature (C)
Fig. 9 Propagation Delay vs Load Resistance
10
V
CC
= 3.3V
TA = 25C
tP - Propagation Delay (s)
tPLH, IF = 16mA
1
tPLH, IF = 10mA
tPHL, IF = 10mA
tPHL, IF = 16mA
0.1 1 2 3 5 10
R L- Load Resistance (k)
6 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Fig. 10 Switching Time Test Circuit
Pulse Generator I F tr = 5ns Z O = 50 10% D.C. I/f < 100s
1
+
Noise Shield
8 7 6 5
VCC
+3.3 V
Pulse Generator tr = 5ns Z O = 50
IF
+
Noise Shield
1
VF1 -
8 7 6 5
VCC RL
+3.3 V
2
VF -
VB
RL
10% DUTY CYCLE I/f < 100S VO
2 3 4
V01
VO C L = 1.5 pF
3
I F Monitor Rm
VO 0.1 F
IF MONITOR VF2 + Rm
V02 0.1 F
4
GND
GND
C L = 1.5 pF
Test Circuit for FOD050L and FOD250L
Test Circuit for FOD053L
IF 0
VO 50% 50% VOL TPHL TPLH
3.3 V
Fig. 11 Common Mode Immunity Test Circuit
IF Noise Shield Noise Shield
1
+
8 7 6 5
VCC
+3.3 V IF
+ VF1 A
1 2 3 4
8 7 6 5
VCC RL V01
+3.3 V
2
A B VFF VF -
VB
RL
VO
3 4
+
VCM
VO
VO 0.1 F
B VFF
VF2 +
V02
0.1 F
GND
-
GND
-
Pulse Gen
+
VCM -
Pulse Gen Test Circuit for FOD050L and FOD250L Test Circuit for FOD053L
VCM 1000 V 10% tr
90%
90% 10% tf
0V
VO Switch at A : IF = 0 mA VO Switch at A : IF = 16 mA
3.3 V
VOL
7 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Ordering Information
Option
No Suffix S SD SV SDV T TV R1 R1V R2 R2V V
Order Entry Identifier
FOD250L FOD050L FOD250LS FOD250LSD Pending Approval Pending Approval FOD250LT Pending Approval FOD050LR1 Pending Approval FOD050LR2 Pending Approval Pending Approval
Description
Through Hole (DIP package only) Surface Mount Lead Form (SOIC-8 package only) Surface Mount Lead Bend (DIP package only) Surface Mount; Tape and reel (DIP package only) Surface Mount; VDE0884 (DIP package only) Surface Mount; Tape and reel, VDE0884 (1000 units per reel) (DIP package only) 0.4" Lead Spacing (DIP package only) 0.4" Lead Spacing, VDE0884 (DIP package only) Tape and Reel (500 units per reel) (SOIC-8 package only) VDE, Tape and Reel (500 units per reel) (SOIC-8 package only) Tape and Reel (2500 units per reel) (SOIC-8 package only) VDE, Tape and Reel (2500 units per reel) (SOIC-8 package only) VDE (SOIC-8 package only)
Marking Information
DIP
1 1
SOIC
2
50L V X YY S
6
250L V
3 4
2 6
XX YY T1
5
3
4
5
Definitions
1 2 3 4 (DIP) 4 (SOIC) 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) Two digit year code, e.g., `03' One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code
8 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Package Dimensions (8-Pin DIP)
Through Hole
PIN 1 ID.
4 3 2 1
Surface Mount
0.390 (9.91) 0.370 (9.40)
4 3 2 1
0.270 (6.86) 0.250 (6.35)
5 6 7 8
PIN 1 ID.
0.270 (6.86) 0.250 (6.35)
0.390 (9.91) 0.370 (9.40)
5
6
7
8
SEATING PLANE
0.070 (1.78) 0.045 (1.14) 0.200 (5.08) 0.140 (3.55) 0.020 (0.51) MIN
0.070 (1.78) 0.045 (1.14) 0.020 (0.51) MIN
0.300 (7.62) TYP 0.016 (0.41) 0.008 (0.20)
0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 15 MAX 0.300 (7.62) TYP
0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP Lead Coplanarity : 0.004 (0.10) MAX
0.045 [1.14] 0.315 (8.00) MIN 0.405 (10.30) MIN
0.4" Lead Spacing
4 3 2 1
8-Pin DIP
PIN 1 ID.
0.070 (1.78)
0.270 (6.86) 0.250 (6.35)
0.060 (1.52)
5 6 7 8
0.390 (9.91) 0.370 (9.40)
0.100 (2.54) 0.295 (7.49)
0.070 (1.78) 0.045 (1.14)
SEATING PLANE
0.415 (10.54)
0.030 (0.76)
0.200 (5.08) 0.140 (3.55)
0.004 (0.10) MIN
0.154 (3.90) 0.120 (3.05) 0.022 (0.56) 0.016 (0.41) 0.100 (2.54) TYP 0.016 (0.40) 0.008 (0.20) 0 to 15 0.400 (10.16) TYP
Note: All dimensions are in inches (millimeters)
9 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
Package Dimensions (8-Pin SOIC)
Surface Mount
PIN 1 ID.
8-Pin Small Outline
0.024 (0.61)
0.164 (4.16) 0.144 (3.66)
SEATING PLANE
0.060 (1.52)
0.202 (5.13) 0.182 (4.63)
0.275 (6.99) 0.155 (3.94)
0.010 (0.25) 0.006 (0.16)
0.143 (3.63) 0.123 (3.13)
0.021 (0.53) 0.011 (0.28)
0.008 (0.20) 0.003 (0.08) 0.050 (1.27) TYP
0.244 (6.19) 0.224 (5.69)
0.050 (1.27)
Lead Coplanarity : 0.004 (0.10) MAX
Note: All dimensions are in inches (millimeters)
10 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
8-Pin DIP (FOD250L)
Carrier Tape Specification
12.0 0.1 4.0 0.1 4.0 0.1 O1.55 0.05 1.75 0.10
4.90 0.20
0.30 0.05
7.5 0.1 13.2 0.2 16.0 0.3 10.30 0.20
0.1 MAX
10.30 0.20
O1.6 0.1
User Direction of Feed
Reflow Profile
* Peak reflow temperature * Time of temperature higher than 245C * Number of reflows 260 C (package surface temperature) 40 seconds or less Three
300 250 Temperature (C) 200 150
10 s 260 245
40 s 100 50
50
100
150 Time (s)
200
250
11 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
8-Pin SOIC (FOD050L, FOD053L)
Carrier Tape Specification
8.0 0.10 3.50 0.20 0.30 MAX 4.0 0.10 2.0 0.05 O1.5 MIN 1.75 0.10
5.5 0.05 8.3 0.10 12.0 0.3 5.20 0.20
0.1 MAX
6.40 0.20
O1.5 0.1/-0
User Direction of Feed
Reflow Profile
300 280 260 240 220 200 180 Time above 183C = 90 Sec >245C = 42 Sec 260C
C
160 140 120 100 80 60 40 20 0 0 60 120 180 33 Sec 1.822C/Sec Ramp up rate
270
360
Time (s)
12 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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FOD050L, FOD250L, FOD053L LVTTL/LVCMOS 3.3V High Speed Transistor Optocouplers
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FAST(R) FASTrTM FPSTM FRFETTM DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM
SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM
UniFETTM UltraFET(R) VCXTM WireTM
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I20
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
13 FOD050L, FOD250L, FOD053L Rev. 1.0.0
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